2. 3/3 An electronic component schematically shown in Figure 2 is made up of two different components with thermal conductivities K₁ = 50 W/mK and K, 10 W/mK, densities p₁ = 1000 kg/m³ and p₁ = 2000 kg/m³, and specific heats c₁ = 500 J/kgK and c₂ = 250 J/kgK. There is a volumetric heat generation q"=1.0 MW/m³ in the component with thermal conductivity K₁. The boundaries AH and FG are kept at constant temperatures of T₁ = 600K and T₁ = 300K (please note these are not temperatures of nodes 1 and 2) respectively. The boundaries AB, BC, CD, DE and EF are in contact with air at ambient temperature T = 295K and the corresponding heat transfer coefficient is h=500 W/m²K. The above configuration is discretised using the mesh shown in Figure 2 where a uniform grid with spacing Ax = Ay = 0.01m is used. For each of the five nodes 2, 7, 9, 12 and 18 evaluate the maximum allowable time step size you are allowed to use if you were to solve an unsteady heat conduction problem for this geometry using an explicit time advancement method. (5x5=25marks) h, To C 16 6 T₁- A Ar 5 17 47 18 D (5x5-25marks 13 14 15 B 10 10 K₁ 11 9 7 12 12 00 E Ay F G T₂ 2 H Symmetry 2 K₂ Figure 2 q"