In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature To, a radiant source is used to pro- vide a heat flux q" (W/m²), all of which is absorbed at the bonded surface. The back of the substrate is maintained at 7, while the free surface of the film is exposed to air at To and a convection heat transfer coefficient h. Air 1. h 90" Li Film L₁ Substrate L= 0.25 mm k = 0.025 W/m-K L₁ = 1.0 mm Bond, Tok, 0.05 W/m-K T₁- (a) Show the thermal circuit representing the steady-state heat transfer situation. Be sure to label all elements, nodes, and heat rates. Leave in symbolic form. (b) Assume the following conditions: T, = 20°C, h = 50 W/m² K, and T₁ = 30°C. Calculate the heat flux go that is required to maintain the bonded sur- face at T₁ = 60°C. (c) Compute and plot the required heat flux as a func- tion of the film thickness for 0≤ L, ≤ 1 mm. (d) If the film is not transparent and all of the radiant heat flux is absorbed at its upper surface, determine