Show all your calculations and state all your assumptions!! Problem 1. It is well known that the Au-Al IMC layer becomes a serious reliability thread to Au wirebonds when the thickness of this IMC layer reaches the threshold of 10μm. As a process technology development engineer you are asked to estimate how long can a Plastic Encapsulated Microcircuit (PEM) be operated at an application temperature of 85°C before the Au wires fail by lift off at the Au-Al interface due to an excessive IMC layer. (25 pts.) You are given previous experimental data obtained by one of your co-workers on a 1 mil Au wire welded to Al pads by a thermosonic process. (Note that k = 8.617 X 10-5 eV/K). The data is as follows: At 300°C (573K): IMC thickness (X) [µm]: Time (s): 20 8 80 300 4000 535 10 13 25 At 200°C (473K): Time (s): 10 3 60 4 300 5 4000 10 IMC thickness (X) [µm]: